PATTERN AND PROCESS DEPENDENCIES IN COPPER
process II EXPERIMENTAL METHODOLOGY A DESIGN OF EXPERIMENT A short flow process is carried out to simplify the process and to minimize sources of variation from non CMP processes All processes are carried out using 8 200 mm wafers First µ m of TEOS is deposited on a bare silicon wafer
THE CHEMICAL PROCESS INDUSTRY KFUPM
THE CHEMICAL PROCESS INDUSTRY The chemical process industry includes those manufacturing facilities whose products result from a chemical reactions between organic and/or inorganic materials; b extraction separation or purification of a natural product with or without the aid of chemical reactions;